Liquid alloys are used in many evolving applications currently being developed in research and development labs around the world. Liquid alloys enable these applications, not only because of their ultra-low melting points, but also because of their additional properties. These alloys can wet to surfaces such as glass and polymers.
The eutectic alloy of 58Bi 42Sn (Indalloy ® 281) melts at 138 ° C and is one of the more popular bismuth contained alloys. Low-temperature alloys (including bismuth-containing and indium-containing alloys) need special flux vehicles that have activators lower than standard SMT pastes.
Bi-based low-temperature alloys are unable to withstand even moderate drop shock. Durafuse® LT is a low-temperature Pb-free solder capable of reducing peak reflow temperature by 40°C relative to SAC305, with drop shock reliability two orders of magnitude greater than standard low-temperature alloys. Durafuse ® LT samples in the
Durafuse ® LT is made up of a low-melting indium-containing alloy and a higher-melting SAC alloy. The required peak reflow temperature is under 210 ° C. The SnInAg alloy initiates joint fusion while the SAC alloy provides enhanced …
INDIUM: SMT expert Phil Zarrow interviews Carol Gowans, incubator market manager for Indium Corporation, about the benefits of using low-temperature alloys bismuth and indium.
Low-temperature thermocatalytic aqueous phase methanol reforming on Pt/defective-indium oxide. ... PdIn alloy has also been reported as the active phase for catalytic activity and selectivity of MSR [26]. Integrating indium into Cu-based catalysts (Cu/SiO 2) ...
Indium Corporation Expert to Present on Low-Temperature Solder Paste at SMTA Empire Expo September 14, 2023 ... As manager of the alloy group in Indium Corporation's R&D department, Dr. Zhang's focus is on the development of Pb-free solder materials and the associated technologies for high-temperature and high-reliability applications ...
INDIUM: Some alloys that melt below 300° Celsius are used for applications other than ... Low temperature alloys can be cast onto a part and removed after processing with low heat, perhaps in the form of a heat gun or hot water. ... which make them great fuses. Imagine a plug for an oil pan made from an alloy that melts at 118°C. If the oil ...
Indalloy ® 303, also known as Bi+, is an innovative alloy that retains the low reflow temperatures required for temperature-sensitive processes while enhancing the lifetime reliability of the solder joint beyond that of …
Indium Corporation Acquires SAFI-Tech to Advance Low-Temperature Soldering Technology October 3, 2023. Indium Corporation, an international electronics materials refiner, smelter, manufacturer, and supplier, …
Transitioning to Low- or Mid-Temperature Solders Can Reduce your Carbon Footprint. 05 Jan 2024 by Indium Corporation® | View Bio. Typical analyses of low- and mid-temperature solders focuses on improvements to important metrics such as …
Durafuse ® LT Durafuse ® LT is a patented low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C.. Durafuse ® LT provides improved drop shock resilience, outclassing bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and performing better than SAC305 with optimum process …
temperatures. This alloy, with a melting temperature range from 214–229°C, exhibited the ambient temperature yield strength of 81.2 MPa, double that of both SAC305 and Alloy #I. The thermal fatigue behavior was investigated under two typical thermal cycling profiles: 1) -40–125°C and 2) -40–150°C. The thermal
Low-temperature solder alloys have also been of increased interest to the SMT industry for a variety of reasons including component sensitivity, step soldering, and reduced energy consumption. However, while the reduced temperature and subsequent energy during reflow have often been listed as a benefit, it has rarely been publicly quantified.
A plateau region between low- and high-temperature alloy liquidus temperatures facilitates alloy fusion. Peak reflow temperature between 200–210°C is ideal to form an optimally fused solder joint. Peak temperatures below 200°C may fail to capture the full drop shock capability of Durafuse ® LT. Cooling Stage:
Form No. 99375 R5 PRODUCT DATA SHEET Indium5.7LT-1 Low-Temperature Solder Paste Introduction Indium5.7LT-1 is an air reflow, halogen-free, no-clean solder paste designed for assembly processes using Bi-based and In-based low-temperature alloys. This paste is a clear residue product with exceptional wetting capabilities.
Others feel that any alloys that melt lower than the melting point of 63Sn/37Pb (183°C) are classified as low-temperature solder alloys. It is all relative to whichever alloy the user deems "standard." Many low-temperature alloys include indium, bismuth, and/or gallium, which suppress the melting point.
Durafuse ® LT provides improved drop shock resilience, outclassing bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and performing better than SAC305 with optimum process setup. Durafuse ® LT is made up of a low-melting …
Durafuse ® LT is made up of a low-melting indium-containing alloy and a higher-melting SAC alloy. The SnInAg alloy initiates joint fusion while the SAC alloy provides enhanced strength …
Low-Temperature Soldering. Indium Corporation makes a wide range of alloys that melt or reflow below 180°C and can be used to solve a great many assembly and other challenges. Low-temperature solder is often used in electronics …
Sn/Pb/Ag alloys: These alloys are similar to 63Sn/37Pb but use a small amount of silver to lower the melting point and to increase shear strength, wetting, and fatigue resistance - when compared to traditional Sn/Pb. Indium-based alloys: Indium-based alloys have superior thermal conductivity and ductility compared to other low-temp alloys ...
Let's take a closer look at low temperature solder alloys. ... Auf Indium basierende Legierungen: Auf Indium basierende Legierungen bieten eine überragende Wärmeleitfähigkeit und -duktilität im Vergleich zu anderen Niedertemperaturlegierungen. Zudem ist …
Indium Corporation Introduces Cutting-Edge, High-Reliability Alloy for Solder Paste June 14, 2024. Indium Corporation® is proud to introduce Durafuse® HR, a new high-reliability alloy used for solder paste, developed from the company's Durafuse® mixed-alloy technology. Durafuse® HR is a patent-pending alloy system that delivers enhanced thermal cycling …
Indalloy ® 303, also known as Bi+, is an innovative alloy that retains the low reflow temperatures required for temperature-sensitive processes while enhancing the lifetime reliability of the …
INDIUM: Do you ever have a need for a "low temperature" solder (meaning an alloy that melts at less than 175C)? You may have delicate components that cannot withstand standard reflow temperatures, or maybe you are looking to reduce costs by lowering the reflow temperature, or you may be step soldering....
One of indium metal's unique characteristics is its low-melting point. Low-temperature alloys, which typically contain indium or bismuth, melt at temperatures less than 180°C. These alloys are used in a wide variety of applications, including: Step soldering involving temperature-sensitive components
Indium Corporation ® does not recommend, manufacture, market, or endorse any of our products for human consumption or to treat or diagnose any disease. All of Indium Corporation ® 's products and solutions are designed to be …
Durafuse® LT is a novel solder paste mixed-alloy system for low-temperature reflow processes which require high drop shock reliability. Durafuse® LT is made up of a low-melting In …
Indium5.7LT-1 is an air reflow, halogen-free, no-clean solder paste designed for assembly processes using Bi-based and In-based low-temperature alloys. This paste is a clear residue …